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网校开发及拥有的课件范围涉及公务员、财会类、外语类、外贸类、学历类、

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时间：10月10日（星期五）上午10：30

地点：安徽理工大学大学生创业基地

需求专业：电子科学与技术、电子信息工程、微电子、机械电子、通信、自动化、仪器与测量、生物医学工程等相关专业

泰瑞达（上海）有限公司招聘简章

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. Teradyne provide test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells in system-on-a-chip (SOC) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and Internet applications. We deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. Teradyne was founded at Boston in 1960. With the development of global testing business, we established the Teradyne Shanghai Co. Ltd. in China in 2001. And we also have an extension office of Application Development Center in Hefei in 2007 in order to satisfy the ever growing business demand. In 2013, Teradyne had sales of $1.43 billion and currently employs about 3,800 people worldwide.

泰瑞达公司

泰瑞达(美国纽约证券交易所上市企业)是全球最大的集成电路自动测试设备供应商。产品主要是用于半导体、板卡及电子系统的测试平台。泰瑞达为包括处理器、微控制器、消费类电子产品、汽车电子、存储器、混合讯号IC、片上系统、射频身份识别IC及通信系统在内的电子产品提供优质高效的测试方案。泰瑞达的客户均为全球顶尖的半导体、电子、自动化及通讯设备厂商。在半导体测试设备供应商中，泰瑞达是唯一能覆盖模拟,混合信号,存储器及VLSI器件等所有领域的。泰瑞达成立于1960年，总部设于美国马萨诸塞州首府波士顿。随着全球测试业务的发展，泰瑞达2001年在上海成立中国总公司，于2007在合肥设立了应用开发部门的分支机构以满足日益增长的业务需求。2013年，泰瑞达全球销售总额达14亿美元。目前，全球员工约3800名。

For more information, please visit company’s websitehttp://www.teradyne.com.

Job Title: Applications Engineer (应用开发工程师)

Organization: Center Engineering Organization, China Application Development Center (ADC)

Work Location: Hefei (合肥)

Job Description

Develop highly sophisticated SOC test solutions（circuit design, signal processing, programming, debug,…similar to Embedded System Design）for world-wide customers

Provide innovative engineering solutions to conquer unique challenges

Fly overseas to personally install your solution on-site

Collaborate with overseas experts on a daily basis

Requirements

Bachelors or Master’s degree in Electronic Engineering or similar areas

Knowledge of Digital Signal Processing is desirable

Experience in analysis and debug of digital/analog circuits

Unix/C/C++ or Windows/VB programming experience

Excellent interpersonal and teamwork skills.

Experienced in problem solving

Excellent spoken and written English communication skills

Automatic Testing Equipment experience will be a plus.

Job Title: Software Engineer (软件工程师)

Organization: Center Engineering Organization, China Application Development Center (ADC)

Work Location: Hefei (合肥)

Job Description

Unix/Linux Operating System programming

Design plugin for Automatic Test Equipment with C, C++ or .NET platform

Develop platform to platform converters with perl, C# or VB.net

Responsible for the full cycle of software development – investigation tasks, initial design, development, bug fixing, quality engineering, documentation, and maintenance

Requirements

Bachelor degree in Computer Science or Software Engineering. Master degree is desirable.

Must possess a strong understanding of Compiling Fundamental and Object-Oriented Programming.

Must possess a minimum of 1+ years experience in software development.

Must possess a good understanding of Software Engineering theories and methodologies.

Familiar with Microsoft .Net Platform.

Familiar with C#, C++, C, VB, Python, Perl and other programming language.

Familiar with Microsoft Windows, Sun Solaris Unix and Linux system.

ATE experience will be a plus.

Good command of spoken and written English.

Strong self-motivation and good communication skills.

Job Title: Hardware Design Engineer (硬件研发工程师)

Organization: Global Hardware Business Unit, China Hardware Design Center (HDC)

Work Location: Hefei (合肥)

Role Summary/Purpose

Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology, work here can be challenging and exciting.

Job Description

Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers

Provide global hardware design support and consulting

Give global hardware infrastructure support and consulting

Deliver hardware design training and seminars to customers

Do hardware project management

Keep close communication with worldwide Teradyne teams and customers

Requirements

Master’s or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering

Good knowledge and understanding of electronic circuit theory and application

Experience in one or more EDA tools, such as Cadence, OrCAD, Protel, PADS or Mentor Graphics

Knowledge and experience in multi-layer board design

Knowledge and experience in embedded system design

Good communication skills, good written and oral English

Ability to effectively solve problems, open minded

Ability to successfully work in a team, cross-functional environment

Ability to travel oversea for extended period of time

Knowledge/Experience in the following areas is a plus

High-speed design and RF circuitry design

Simulation tools and application, such as Siwave, HFSS, Sigrity

FPGA design and programming/debugging(VHDL, Verilog)

Mechanical design, familiar with one or more CAD tool, like Solid works, AutoCAD

One or more programming/script language(C, VB, Perl, Python)

Signal integrity(SI) theory and application

Design For Manufacturing(DFM)

German, Japanese or Korean language skill

欢迎电子科学与技术、电子信息工程、微电子、机械电子、通信、自动化、仪器与测量、生物医学工程等相关专业同学投递简历，请关注院校宣讲会信息现场投递简历或将简历投递至：hr.recruiting.shanghai@teradyne.com

备注：投递简历时，请在邮件的主题里注明：毕业学校+应聘职位“硬件研发工程师” 或“应用开发工程师”或“软件工程师”。

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